Processors and chipsets keep getting upgraded to make the performance of electronic devices smooth. MediaTek Dimensity 8400 chipset has also been in the news for a long time. Much information related to this chipset has also come to the fore.
A tipster from China has recently shared the specifications of this chipset. Let us know in detail about the MediaTek Dimensity 8400 chipset specifications in this blog.
Specifications of MediaTek Dimensity 8400 chipset
Information about MediaTek Dimensity 8400 has been shared by Chinese tipster “Digital Chat Station”. It has been posted on Weibo. According to the information received from the post, the AnTuTu score of this chipset is 1.8 million.
These scores are higher than the Dimensity 8300-Ultra SoC powered Redmi K70E and POCO X6 Pro’s AnTuTu scores of 1.52 million and 1.48 million respectively.
MediaTek Dimensity 8400 chipset Processor
The MediaTek Dimensity 8400 chipset uses TSMC 4nm process. The A5xx cores have been removed from this chipset. All Cortex-A725 cores have been used in place of A5xx cores. It is based on a new octa core architecture.
Of these, its prime Cortex-A725 core runs at a clock speed of 3.25GHz, apart from this, 3 Cortex A725 cores run at a clock speed of 3.0GHz and the remaining 4 Cortex A725 cores run at a clock speed of 2.1GHz. With this, 1.3GHz Immortalis G720 MC7 GPU has been included.
May be launched in December
According to some leaks, it is being said that MediaTek Dimensity 8400 can be launched on 23 December.
It is also being said that the first phone to run on this chipset can be Redmi Turbo 4. According to some leaks, this phone of Redmi can also be launched in early 2025.
According to the news, this phone is likely to have a 1.5K LTPS flat display with thin bezels and a 6500mAh battery.
A 50-megapixel camera can be given on the back panel of the phone. This phone can come with a glass finish on the back panel and can be launched with a plastic body.